Gary L Anderson

Title: Innovations by Gary L. Anderson

Introduction

Gary L. Anderson is a notable inventor based in St. Ann, MO (US). He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on improving the processes involved in semiconductor wafer handling and polishing.

Latest Patents

One of his latest patents is a "Method of estimating post-polishing waviness characteristics of a semiconductor wafer." This innovative method estimates the likely waviness of a wafer after polishing by accurately measuring the waviness of the wafer in its as-cut condition. The process involves measuring the thickness profile of both the upper and lower surfaces of the wafer to construct a median profile in the direction of wiresaw cutting. The median surface is then filtered using a Gaussian filter to estimate whether the wafer will exhibit unacceptable waviness after polishing.

Another significant patent is the "Method and apparatus to place wafers into and out of machine." This system facilitates the transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting the face of the wafer. The system includes a wafer transport that is positioned above the carrier, featuring an open cavity that aligns with the carrier's opening. This design allows for the safe handling of the wafer while minimizing the risk of damage.

Career Highlights

Gary L. Anderson is currently employed at Memc Electronic Materials, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in enhancing the efficiency and effectiveness of wafer processing techniques.

Collaborations

He has collaborated with notable coworkers such as Brent F. Teasley and Keith Wilson, contributing to advancements in their shared field of expertise.

Conclusion

Gary L. Anderson's contributions to semiconductor technology through his patents and work at Memc Electronic Materials, Inc. highlight his role as a key innovator in the industry. His methods for wafer handling and polishing are paving the way for improved semiconductor manufacturing processes.