Location History:
- Macroom, IE (2002 - 2003)
- Woodstock, VT (US) (2005 - 2009)
Company Filing History:
Years Active: 2002-2009
Title: The Innovative Mind of Gary Horsman: Pioneering Surface Mount Multichip Devices
Introduction: Gary Horsman is a notable inventor based in Woodstock, Vermont, USA, recognized for his contributions in the field of semiconductor technology. With a portfolio of five patents, he has made significant advancements that continue to influence the industry.
Latest Patents: Among his recent innovations, Gary Horsman has developed a surface mount multichip device. This innovative device features first and second lead frame portions and incorporates at least two semiconductor chips. The design includes header regions and lead regions on the lead frame portions, benefiting from a common plane where the header regions of both portions reside. Placement of a semiconductor chip on each header region, coupled with the use of a conductive member link, facilitates electrical and mechanical interconnections between the chips.
Career Highlights: Garry Horsman has built a reputable career at General Semiconductor, Inc., where he focused on advancing semiconductor design and technology. His innovative approaches and technical expertise have contributed to the development of cutting-edge products that enhance electronic device performance.
Collaborations: Throughout his journey, Gary has collaborated with notable coworkers such as Paddy O'Shea and Eamonn Medley. Their collective efforts have played a crucial role in propelling innovations within the company and the broader semiconductor landscape.
Conclusion: Gary Horsman exemplifies the spirit of innovation in the semiconductor industry. His work on surface mount multichip devices showcases his dedication to improving technology through inventive designs and collaborations, ensuring a lasting impact on the field.