Gary Daniel Redding

This inventor holds 39 USPTO granted patents and 2 EPO patents, primarily in 3D Printing Technology. Top assignees: Xerox Corporation, Brown University. Active years: 2001-2024.

USPTO Granted Patents = 39

% Patents Active = 69.2

EPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 132(Granted Patents)

Location History:

Victory, NY (US) (2015)
Victor, NY (US) (2001 - 2022)
Dansville, NY (US) (2023)

Company Filing History:

where one patent can have more than one assignee

Years Active: 2001-2024

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Areas of Expertise:

3D Printing

Printhead Design

Filament Heating

Additive Manufacturing

Electrostatic Actuators

Piezoelectric Arrays

Thermal Treatment

Linear Sensor Arrays

Ink Jet Printheads

Electrical Interconnections

Polymer Film

Die Storage Tray

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12122178 - Imaging blanket and variable data lithography system employing the imaging blanket (2024-10-22),

2. 11766829 - Surface treated additive manufacturing printhead nozzles and methods for the same (2023-09-26),

3. 11383417 - Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers (2022-07-12),

4. 11025796 - Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays (2021-06-01),

5. 10943895 - Method of fabricating a plurality of linear arrays with submicron y-axis alignment (2021-03-09),

6. 10814544 - Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers (2020-10-27),

7. 10629515 - System and method for cooling digital mirror devices (2020-04-21),

8. 10625466 - Extrusion printheads for three-dimensional object printers (2020-04-21),

9. 10421277 - Lead-free piezo printhead using thinned bulk material (2019-09-24),

10. 10252525 - Lead-free piezo printhead using thinned bulk material (2019-04-09),

11. 10166777 - Method of forming piezo driver electrodes (2019-01-01),

12. 10134793 - Method of forming two-dimensional and three-dimensional semiconductor chip arrays (2018-11-20),

13. 9931843 - Raised fluid pass-through structure in print heads (2018-04-03),

14. 9802408 - Raised fluid pass-through structure in print heads (2017-10-31),

15. 9757900 - Pin-actuated printhead (2017-09-12),

Title: The Inventor Profile of Gary Daniel Redding

Introduction: Gary Daniel Redding, a talented inventor hailing from Victor, NY (US), has made significant contributions to the field of innovations with his creative and groundbreaking ideas.

Latest Patents: Gary Daniel Redding holds several patents in various industries, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: Throughout his career, Gary Daniel Redding has demonstrated a keen ability to identify gaps in the market and develop unique solutions to address them. His passion for innovation has led to the successful commercialization of several of his inventions.

Collaborations: Gary Daniel Redding has collaborated with leading companies and research institutions to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: Gary Daniel Redding's relentless pursuit of innovation and his commitment to pushing the boundaries of what is possible make him a standout figure in the world of inventors. His work continues to inspire and pave the way for future generations of innovators.