Xerox Corporation

Brown University

Gary Daniel Redding

Peter Johan Nystrom

Mark Anthony Cellura

Bryan R Dolan

Jun Ma

David Allen Mantell

Peter M Gulvin

Andrew Wayne Hays

Chad David Freitag

Chad Johan Slenes

Joseph Fredrick Casey

Jon Garret Judge

Santokh Singh Badesha

Barry Paul Mandel

John Richard Andrews

Varun Sambhy

Christopher G Lynn

Jonathan Robert Brick

John Paul Meyers

David R Koehler

Garry A Jones

Angus Ian Kingon

Seunghyun Kim

Nicholas Mostovych

Chu-Heng Liu

Kock-Yee Law

Steven Robert Moore

Roger Gaylord Leighton

Robert Paul Herloski

William G Hawkins

Christopher Douglas Atwood

Ali Rafic Dergham

Francisco Zirilli

Brian S Hilton

Mark A Adiletta

Michael B Monahan

Antonio L Williams

Xuejin Wen

Samuel Vincent Schultz

Yuanjia Zhang

Lyle G Dingman

Craig Alan Zufelt

George Shannon

Lina Bian

C Glenn Prince

Roy A Trowbridge, Jr

An imaging blanket comprises a base comprising an elastic polymer and sulfur. A barrier layer is on the base and a surface layer is on the barrier layer. The surface layer comprises an elastomer and a platinum catalyst.

Imaging blanket and variable data lithography system employing the imaging blanket

Nozzles for an additive manufacturing device and methods for improving wettability of the nozzles are disclosed. The method may include subjecting the nozzle to a surface treatment. The surface treatment may include contacting a surface of the nozzle with one or more surface modifying agents. The surface modifying agents may include one or more of an oxidizing agent, an acid, a base, or combinations thereof. The one or more surface modifying agents may increase an oxygen content of the surface of the nozzle. An inner surface of the nozzle may have a water contact angle of greater than 1&#xb0; and less than about 90&#xb0;. The inner surface of the nozzle may be free or substantially free of a coating.

Surface treated additive manufacturing printhead nozzles and methods for the same

An additive manufacturing system includes a heater for converting a filament of extrusion material into thermoplastic material. The heater has a channel configured to change the cross-sectional shape of the filament to a cross-sectional shape that has a greater surface area than the surface area of the filament before the heater receives the filament. The channel of the heater can also be configured to drive the center portion of the filament toward the heated walls of the channel and to mix thermoplastic material in the channel while exposing the center portion of the filament to the heated wall of the channel.

Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers

A sensor array assembly including a first sensor array, a second sensor array and a mounting substrate. The first sensor array includes a first process direction width and a first photosite, while the second sensor array includes a second process direction width and a second photosite. The first and second sensor arrays are separately secured on the mounting substrate. The first photosite is in precision alignment with the second photosite.

Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays

A method of assembling a plurality of linear arrays from a silicon wafer having a first surface and a second surface opposite the first surface, the first surface having at least a first linear array of sensor/emitter elements and a second linear array of sensor/emitter elements, each arranged parallel relative to a first direction, and a sacrificial portion positioned between the first linear array of sensor/emitter elements and the second linear array of sensor/emitter elements. The method includes: forming a first cavity in the second surface positioned opposite the sacrificial portion and parallel relative to the first direction; forming at least a first through cut, a second through cut, a third through cut and a fourth through cut in the silicon wafer, the first and second through cuts are parallel to the first direction, the third and fourth through cuts are perpendicular to the first direction, the first through cut arranged adjacent to the first linear array of sensor/emitter elements opposite the sacrificial portion, the second through cut arranged adjacent to the second linear array of sensor/emitter elements opposite the sacrificial portion, and the third and fourth through cuts form a first end and a second end, respectively, of a multi-row sensor/emitter chip defined by the first, second, third and fourth through cuts; bonding at least a portion of the multi-row sensor/emitter chip formed by the second surface of the silicon wafer to a mounting substrate; and, removing the sacrificial portion.

Method of fabricating a plurality of linear arrays with submicron y-axis alignment

An apparatus includes a heater for converting a filament of extrusion material into thermoplastic material. The heater has a channel configured to change the cross-sectional shape of the filament to a cross-sectional shape that has a greater surface area than the surface area of the filament before the heater receives the filament. The channel of the heater can also be configured to drive the center portion of the filament toward the heated walls of the channel and to mix thermoplastic material in the channel while exposing the center portion of the filament to the heated wall of the channel.

A multi-nozzle extrusion printhead includes a chamber with an inlet to receive an extrusion material and a plurality of outlets fluidly coupled to the chamber. The printhead also includes a plurality of valves that control flow of extrusion material through the fluid outlets to nozzles in the printhead. Each valve includes a member and an electromechanical actuator configured to move the member to a first position to block a flow of the extrusion material through one of the fluid outlets and nozzles and to a second position to enable the flow of the extrusion material through the fluid outlet and nozzles.

Extrusion printheads for three-dimensional object printers

A cooling system comprising of a coolant manifold, a heat sink configured to fit in the coolant manifold, a plurality of cooling fins formed in the heat sink, and a coolant configured to flow through the coolant manifold to the heat sink. Diamond shaped pin fins associated with the heat sink create a series of divergent fluid paths for the cooling fluid that helps to create turbulence and improved heat transfer.

System and method for cooling digital mirror devices

An apparatus for a lead-free piezoelectric ink-jet printhead is disclosed. Piezoelectric printheads, while more expensive are favored because they use a wider variety of inks. The piezoelectric printhead includes a diaphragm, a plurality of piezoelectric actuators comprising a lead-free piezoelectric material, at least one nozzle, at least one ink chamber, a top electrode, and a drive circuit. The deflection of the diaphragm on the body chamber contributes to a pressure pulse that is used to eject a drop of liquid from the nozzle. According to an exemplary embodiment, a lead-free piezoelectric printhead operated at smaller thicknesses and significantly higher electric fields is disclosed, along with methods of making such printheads.

Lead-free piezo printhead using thinned bulk material

A method for forming piezoelectric transducers for inkjet printheads includes: forming at least one piezoelectric layer on a substrate; forming at least one electrode pattern by depositing a conductive material on an exposed surface of the at least one piezoelectric layer; and forming a plurality of individual piezoelectric elements from the at least one piezoelectric layer before or after the forming of the at least one electrode pattern.

Method of forming piezo driver electrodes

A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.

Method of forming two-dimensional and three-dimensional semiconductor chip arrays

A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Raised fluid pass-through structure in print heads

A pin actuated printhead includes an orifice through which a material is ejected, a chamber to hold the material to be ejected, a channel connecting the chamber to the orifice, and an actuated pin, to enter the orifice and to eject the material from the orifice. The printhead is configured to eject a material with a viscosity of 10,000 cP or more at an elevated temperature.

Pin-actuated printhead

Growing community of inventors

Victor, NY, United States of America

Gary Daniel Redding