The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

May. 16, 2017
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Joseph F. Casey, Webster, NY (US);

Gary D. Redding, Victor, NY (US);

Craig Alan Zufelt, Macedon, NY (US);

Michael B. Monahan, Webster, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 23/02 (2006.01); H01L 27/146 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14632 (2013.01); H01L 23/544 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.


Find Patent Forward Citations

Casey, Joseph. (2018). Method of forming two-dimensional and three-dimensional semiconductor chip arrays (U.S. Patent No. 10134793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10134793

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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