Hitachi, Japan

Fusao Hojo

This inventor holds 1 USPTO granted patent. Top assignee: Resonac Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fusao Hojo. Retrieved from https://idiyas.com/inventor/fusao-hojo-eu16wj2y

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovations of Fusao Hojo

Introduction

Fusao Hojo is a notable inventor based in Hitachi, Japan. He has made significant contributions to the field of materials science, particularly in the development of epoxy resin compositions. His work has implications for various applications, including electronics and thermal management.

Latest Patents

Fusao Hojo holds a patent for an epoxy resin composition that includes hexagonal boron nitride particles with an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent. This innovative composition is capable of forming a resin matrix with a smectic domain when reacted with the curing agent. The patent also covers a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board that utilize this epoxy resin composition.

Career Highlights

Hojo is currently employed at Resonac Corporation, where he continues to advance his research and development efforts. His work has positioned him as a key figure in the field of thermally-conductive materials.

Collaborations

Fusao Hojo has collaborated with notable colleagues such as Yoshitaka Takezawa and Shingo Tanaka. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Fusao Hojo's innovative work in epoxy resin compositions showcases his dedication to advancing materials science. His contributions have the potential to impact multiple industries, particularly in enhancing thermal management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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