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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11840619 B1

PDFFull Text
Date of Patent:
Dec. 12, 2023

Filed:

Jan. 08, 2020

Epoxy resin composition, thermally-conductive material precursor, b-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Yoshitaka Takezawa, Tokyo, JP;

Shingo Tanaka, Hitachi, JP;

Fusao Hojo, Hitachi, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:

FITCH, EVEN, TABIN & FLANNERY, LLP

Primary Examiner:

Megan McCulley

Int. Cl.
CPC ...
C08K 3/38 (2006.01); B32B 15/092 (2006.01); B32B 27/18 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); H05K 1/03 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/20 (2006.01); C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C08K 3/38 (2013.01); B32B 5/024 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 27/18 (2013.01); B32B 27/26 (2013.01); B32B 27/38 (2013.01); C08G 59/20 (2013.01); C08G 59/24 (2013.01); C08G 59/245 (2013.01); C08J 5/249 (2021.05); C08L 63/00 (2013.01); H05K 1/0201 (2013.01); H05K 1/03 (2013.01); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/302 (2013.01); B32B 2457/08 (2013.01); C08J 2363/04 (2013.01); C08K 2003/385 (2013.01);
Abstract

Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Find Patent Forward Citations

Takezawa, Yoshitaka. (2023). Epoxy resin composition, thermally-conductive material precursor, b-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board (U.S. Patent No. 11840619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11840619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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