Fui Yee Lim

Title: Fui Yee Lim: Innovator in Circuit Module Technology

Introduction

Fui Yee Lim is a prominent inventor based in Sunway SPK, Malaysia. He has made significant contributions to the field of circuit module technology, holding 3 patents that showcase his innovative approach to electronic circuitry.

Latest Patents

His latest patents include "Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules." This invention features a circuit module that comprises a module substrate with a mounting surface, conductive features, and electronic circuitry. The encapsulant material covers the electronic circuitry and the mounting surface, with leadframe terminals extending through the encapsulant material. Each leadframe terminal is electrically coupled to the electronic circuitry, enhancing the module's functionality.

Another notable patent is "Circuit modules with front-side interposer terminals and through-module thermal dissipation structures." This circuit module includes a module substrate, a thermal dissipation structure, and a semiconductor die. The encapsulant material covers the mounting surface and the semiconductor die, while the interposer is embedded within the encapsulant material, providing efficient thermal management.

Career Highlights

Fui Yee Lim is currently employed at NXP USA, Inc., where he continues to develop innovative solutions in circuit technology. His work has significantly impacted the efficiency and performance of electronic devices.

Collaborations

He has collaborated with notable coworkers, including Boon Yew Low and Fernando A Santos, contributing to various projects that enhance circuit module designs.

Conclusion

Fui Yee Lim's contributions to circuit module technology through his patents and work at NXP USA, Inc. highlight his role as an influential inventor in the electronics industry. His innovative designs continue to shape the future of electronic circuitry.