Hsinchu, Taiwan

Fu-Hsing Shen

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fu-Hsing Shen. Retrieved from https://idiyas.com/inventor/fu-hsing-shen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Fu-Hsing Shen and a Patent for Preventing Silicon Hole Defects

Introduction

Fu-Hsing Shen is an inventor associated with Hsinchu, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work addresses a wet-cleaning challenge in semiconductor wafer processing: preventing silicon hole defects caused by ammonia vapor.

Latest Patents

Shen is listed as an inventor on one patent, 1 patent: “Method and Apparatus for Preventing Silicon Hole Defect Formation After Wet Cleaning.” The invention describes a wet-cleaning system with a supply tank and a cleaning tank connected by a conduit. A cooling tube wrapped around the conduit carries water below 20°C to help prevent ammonia vapor from forming near the cleaning and rinse tanks. The apparatus may also include a pump, a safety overflow conduit, and a flow-control valve. By reducing exposure to concentrated aqueous ammonia, the method aims to prevent silicon hole defects on wafer surfaces.

Career Highlights

Shen’s listed patent is focused on improving process control and protecting silicon wafers during wet cleaning. The disclosed approach combines temperature management with fluid-handling components in a semiconductor cleaning station.

Collaborations

The patent lists Bor-Hann Hsieh and Jeng-Lian Lin as Shen’s coworkers. Their inclusion reflects a collaborative context for the invention, though the available information does not specify their individual contributions.

Conclusion

Fu-Hsing Shen’s patent presents a practical approach to reducing ammonia-vapor formation during wafer cleaning and preventing related silicon hole defects.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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