Noblesville, IN, United States of America

Frank Stepniak


 

Average Co-Inventor Count = 3.3

ph-index = 7

Forward Citations = 157(Granted Patents)


Company Filing History:


Years Active: 2001-2005

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7 patents (USPTO):Explore Patents

Title: The Innovative Mind of Frank Stepniak

Introduction

Frank Stepniak, an accomplished inventor based in Noblesville, IN, has significantly contributed to the field of semiconductor packaging with his innovative approaches. With a total of seven patents to his name, his work has led to advancements that improve the efficiency and reliability of electronic components.

Latest Patents

Among Stepniak's latest patents are two remarkable innovations: the "No-flow underfill process and material therefor" and the "Wafer-applied underfill process." The no-flow underfill material and process are designed for underfilling bumped circuit components. The underfill material is a dielectric polymer that includes a precursor that can react to form an inorganic filler. This innovative process involves dispensing the material over substrate terminals, placing the component, and reflowing the bumps to create solid electrical connections encapsulated by the underfill layer. Additionally, the wafer-applied underfill process employs a lamination step with a compound film that allows solder bumps on the die to be exposed during lamination, ensuring that the underfill material effectively fills spaces without covering the bumps, thereby retaining solder connections.

Career Highlights

Stepniak's career is marked by his pivotal role at Delphi Technologies, Inc., where he has been instrumental in developing cutting-edge solutions in the semiconductor space. His expertise in materials science and engineering has propelled advancements that address the challenges faced by modern electronics.

Collaborations

Throughout his career, Frank has collaborated with notable colleagues, including William David Higdon and Arun K Chaudhuri. These partnerships have fostered an environment of creativity and innovation, allowing them to tackle complex problems in semiconductor packaging.

Conclusion

Frank Stepniak is a formidable inventor whose contributions through his patents not only illustrate his technical prowess but also enhance the foundation of modern electronic design and manufacturing. His ongoing work promises to continue influencing the industry and drive further innovations.

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