The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Mar. 18, 2003
Arun K. Chaudhuri, Carmel, IN (US);
Derek B. Workman, Noblesville, IN (US);
Frank Stepniak, Noblesville, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Arun K. Chaudhuri, Carmel, IN (US);
Derek B. Workman, Noblesville, IN (US);
Frank Stepniak, Noblesville, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A no-flow underfill material and process suitable for underfilling a bumped circuit component. The underfill material initially comprises a dielectric polymer material in which is dispersed a precursor capable of reacting to form an inorganic filler. The underfill process generally entails dispensing the underfill material over terminals on a substrate, and then placing the component on the substrate so that the underfill material is penetrated by the bumps on the component and the bumps contact the terminals on the substrate. The bumps are then reflowed to form solid electrical interconnects that are encapsulated by the resulting underfill layer. The precursor may be reacted to form the inorganic filler either during or after reflow.