Frank R Deweese

Title: Frank R Deweese: Innovator in Integrated Circuit Technology

Introduction

Frank R Deweese is a notable inventor based in McMinnville, OR (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His work focuses on innovative packaging and connection methods for integrated circuits, which are essential for modern electronic devices.

Latest Patents

One of Frank's latest patents is titled "Compact package assembly and methods for the same." This invention involves a package assembly that includes a device package with a specific perimeter footprint. The design features a package riser that is coupled with the device package, which enhances the overall functionality and efficiency of the assembly. Another significant patent is the "Hybrid compression socket connector for integrated circuits." This invention allows for the coupling of an integrated circuit to a circuit board without the need for a backing plate, utilizing a compression socket to establish electrical connections effectively.

Career Highlights

Frank R Deweese is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His work at Intel has allowed him to push the boundaries of technology and contribute to advancements in integrated circuit design.

Collaborations

Throughout his career, Frank has collaborated with talented individuals such as Ashok N Kabadi and Pritulkumar Shah. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Frank R Deweese is a distinguished inventor whose work in integrated circuit technology has led to significant advancements in the field. His patents reflect a commitment to innovation and efficiency, making him a valuable contributor to the technology landscape.