Intel Corporation

Frank R Deweese

Ashok N Kabadi

Pritulkumar Shah

Michael Likov

A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face.

Compact package assembly and methods for the same

The apparatus and method described herein are for coupling an integrated circuit to a circuit board, while eliminating the need for a backing plate, when a compression socket is utilized. A plurality of tension pins are coupled to an integrated circuit for engaging a plurality of corresponding barrels in a circuit board to compress a compression socket to make an electrical connection between the integrated circuit and the circuit board.

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McMinnville, OR, United States of America

Frank R Deweese