This inventor holds 5 USPTO granted patents. Top assignee: Nxp USA, Inc.. Active years: 2017-2024.
Company Filing History:
Years Active: 2017-2024
Title: Frank Danaher: Innovator in Microelectronic Packaging
Introduction
Frank Danaher is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of microelectronics, holding a total of 5 patents. His work focuses on innovative packaging solutions that enhance the reliability and performance of microelectronic devices.
Latest Patents
One of Frank Danaher's latest patents is for overmolded microelectronic packages containing knurled flanges and methods for their production. This invention provides a molded package body that houses at least one microelectronic device. The base flange, to which the molded package body is bonded, features a knurled surface region with trenches arranged in a geometric pattern. This design minimizes the risk of delamination between the molded package body and the base flange, ensuring greater durability and performance.
Career Highlights
Frank Danaher is currently employed at NXP USA, Inc., where he continues to develop innovative solutions in microelectronic packaging. His expertise in this area has led to advancements that benefit various applications in the electronics industry.
Collaborations
Throughout his career, Frank has collaborated with talented individuals such as Michael Lee Fraser and Jason R Fender. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Frank Danaher is a distinguished inventor whose work in microelectronic packaging has made a significant impact on the industry. His innovative patents and collaborations highlight his commitment to advancing technology and improving product reliability.