Frank A Sanders

Title: The Innovations of Frank A. Sanders

Introduction

Frank A. Sanders is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of electronic packaging, holding a total of 5 patents. His work focuses on enhancing the functionality and efficiency of electronic devices through innovative designs.

Latest Patents

Among his latest patents is the "Electronic packaging using conductive interposer connector." This patent describes the formation of a plurality of conductive connectors within an integrated circuit package. The connectors are made with a conductive elastomer material and are formed using an interposer that links multiple conductive connectors together. Another significant patent is the "Three-dimensional flexible interposer." This invention features a generally planar interposer with multiple contact pads designed to interface with the first contacts of an electronic device. It also includes a series of electrical connections to pressure contacts on the opposite side, which are designed to contact a second electronic device. Each pressure contact has a directionally deformable surface, allowing for a secure connection.

Career Highlights

Frank A. Sanders has worked with prominent companies, including Intel Corporation. His experience in the industry has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic packaging technology.

Collaborations

Throughout his career, Sanders has collaborated with notable individuals such as David W. Boggs and John H. Dungan. These collaborations have further enriched his work and led to the development of groundbreaking technologies.

Conclusion

Frank A. Sanders is a distinguished inventor whose work in electronic packaging has led to several important patents. His innovative designs continue to influence the field and enhance the performance of electronic devices.