Intel Corporation

Other

Frank A Sanders

Daryl A Sato

David W Boggs

John H Dungan

Dan Willis

Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Electronic packaging using conductive interproser connector

A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

Three-dimensional flexible interposer

Electronic packaging using conductive interposer connector

There is disclosed a wedge and a T-shaped placement tool therefor. The wedge is used to separate logs placed in a fireplace or stove, thereby improving the flow of air around them and facilitating their burning. The placement tool can be locked to the wedge by a locking means after insertion thereinto, whereupon once the wedge is properly positioned the placement tool can be disengaged. When removal of the wedge from between the logs is desired, a hook member provided on the placement tool can be hooked through a loop provided on the rearwardly extending surface of the wedge.

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Beaverton, OR, United States of America

Frank A Sanders