François Rieutord

Title: François Rieutord: Innovator in Substrate Bonding Technologies

Introduction

François Rieutord is a notable inventor based in Saint Egreve, France. He has made significant contributions to the field of substrate bonding technologies, holding a total of 7 patents. His innovative methods have advanced the way thin layers are prepared and bonded in various applications.

Latest Patents

Rieutord's latest patents include a method for preparing a thin layer that involves forming a weakened zone in a central portion of a donor substrate. This method ensures that the weakened zone does not extend into the peripheral portion of the substrate. The process initiates and propagates a splitting wave in the weakened zone, allowing for the separation of the thin layer from the donor substrate. Another significant patent is a process for hydrophilically bonding substrates. This process involves bringing two substrates into contact to form a bonding interface and applying a heat treatment to close the interface. The bonding layer used in this process is made from a non-metallic material that is permeable to dihydrogen, ensuring effective bonding at lower temperatures.

Career Highlights

Throughout his career, François Rieutord has worked with prominent organizations such as the Commissariat à L'Énergie Atomique et Aux Énergies Alternatives and Soitec. His work in these institutions has allowed him to develop and refine his innovative techniques in substrate bonding.

Collaborations

Rieutord has collaborated with notable colleagues, including Frédéric Mazen and Didier Landru. These partnerships have contributed to the advancement of his research and the successful implementation of his patented technologies.

Conclusion

François Rieutord's contributions to substrate bonding technologies have established him as a key figure in the field. His innovative methods and collaborations continue to influence advancements in this area.