Fenglin Wang

Title: Fenglin Wang’s Semiconductor Process Innovations.

Introduction

Fenglin Wang is an inventor based in Lexington, Massachusetts, and works at Applied Materials, Inc. His patent work focuses on semiconductor manufacturing processes, including resist adhesion and hard-mask performance. Wang is associated with 2 patents.

Latest Patents

Wang’s listed patents address techniques for improving semiconductor processing.

“Ion implantation for increased adhesion with resist material” describes forming a silicon-containing layer on a semiconductor substrate, treating that layer, and contacting it with an adhesion agent before applying a resist layer. The process is intended to improve adhesion between the resist material and the treated underlying layer.

“Selectivity of boron hard masks using ion implant” concerns hard masks used to etch deep capacitor holes in DRAM structures. Rather than relying only on thicker masks, the described approach improves etch selectivity by implanting ions into boron-based hard masks. The implant may occur before or after patterning, and substrate tilting and rotation may help ions penetrate deeper into the openings.

Career Highlights

At Applied Materials, Wang’s patent work addresses process challenges in semiconductor fabrication. The two described inventions focus on material interfaces and etch-mask performance, both relevant to manufacturing increasingly complex semiconductor structures.

Collaborations

Wang’s listed coworkers include Rajesh Prasad and Aykut Aydin. Their names provide context for the professional environment surrounding his work, though the supplied information does not specify their roles in the patents.

Conclusion

Fenglin Wang’s patent portfolio highlights process innovations aimed at improving resist adhesion and hard-mask selectivity in semiconductor manufacturing.