Location History:
- Hsin-Chu, TW (2001)
- Jial Township, Tainan County, TW (2007)
- Tainan, TW (2011 - 2016)
Company Filing History:
Years Active: 2001-2016
Title: Innovations of Feng-Liang Lai in Semiconductor Technology
Introduction
Feng-Liang Lai is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on the development of advanced capacitor devices and manufacturing methods that enhance the performance and efficiency of semiconductor devices.
Latest Patents
Feng-Liang Lai's latest patents include innovative methods for forming semiconductor devices. One of his notable inventions is the "Semiconductor Metal Insulator Metal Capacitor Device and Method of Manufacture." This method involves forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer with a predetermined thickness is then created, which has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The thickness of the first portion can be adjusted by reducing its thickness or adding more dielectric material. A capacitor top plate is subsequently formed over this first portion.
Another significant patent is the "Flexible Processing Method for Metal-Insulator-Metal Capacitor Formation." This method also begins with the formation of a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer is formed, and its thickness is processed to adjust the first portion relative to the second portion. This processing can involve etching or adding dielectric material, culminating in the formation of a capacitor top plate to complete the MIM structure.
Career Highlights
Feng-Liang Lai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His expertise and contributions have positioned him as a key figure in the industry, driving advancements that benefit various applications.
Collaborations
Feng-Liang has collaborated with notable colleagues such as Shean-Ren Horng and Kuo-Nan Hou. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge technologies in semiconductor manufacturing.
Conclusion
Feng-Liang Lai's work in semiconductor technology exemplifies innovation and dedication to advancing the field. His patents reflect a commitment to improving device performance and manufacturing processes. Through his contributions, he continues to shape the future of semiconductor technology.