Ottobrunn, Germany

Ewald Simmerlein-Erlbacher


Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Pegnitz, DE (2006)
  • Ottobrunn, DE (2007)
  • Haimhausen, DE (2009)

Company Filing History:


Years Active: 2006-2009

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3 patents (USPTO):Explore Patents

Title: Ewald Simmerlein-Erlbacher: Innovator in Chip Technology and Metal Structures

Introduction

Ewald Simmerlein-Erlbacher is a notable inventor based in Ottobrunn, Germany. He has made significant contributions to the fields of chip technology and metal structures, holding a total of 3 patents. His work has been instrumental in advancing the functionality and production methods of various electronic components.

Latest Patents

One of his latest patents is for a chip card with contact areas and a method for producing these contact areas. This innovation involves a chip card that features a chip module with an integrated circuit. The card has a main face with a contact zone that includes multiple contact areas, which are electrically connected to the integrated circuit. Notably, the design includes first functional regions with surfaces that are elevated compared to second functional regions, enhancing the card's usability.

Another significant patent involves a process for producing a metal structure in foam form, specifically a metal foam. This process includes several steps, such as providing a nonconductive substrate with a foamed structure and applying conductive particles to the substrate. The substrate is then introduced into an electroplating device, resulting in a homogeneous metal layer formed on the conductive particles.

Career Highlights

Ewald Simmerlein-Erlbacher is currently associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to explore innovative technologies that push the boundaries of electronic components.

Collaborations

Throughout his career, Ewald has collaborated with esteemed colleagues such as Andreas Muller-Hipper and Harald Gundlach. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Ewald Simmerlein-Erlbacher's contributions to chip technology and metal structures exemplify his commitment to innovation. His patents reflect a deep understanding of both practical applications and advanced manufacturing processes. His work continues to influence the field of electronics significantly.

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