Infineon Technologies Ag

Ewald Simmerlein-Erlbacher

Andreas Muller-Hipper

Peter Stampka

Wolfgang Schindler

Andreas Karl

Frank Püschner

Harald Gundlach

A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.

Chipcard with contact areas and method for producing contact areas

Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.

Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam

Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.

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Ottobrunn, Germany

Ewald Simmerlein-Erlbacher