The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Aug. 11, 2004
Applicants:
Harald Gundlach, Grunwald, DE;
Andreas Muller-hipper, Regensburg, DE;
Ewald Simmerlein-erlbacher, Pegnitz, DE;
Inventors:
Harald Gundlach, Grunwald, DE;
Andreas Muller-Hipper, Regensburg, DE;
Ewald Simmerlein-Erlbacher, Pegnitz, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 31/30 (2006.01); B32B 33/00 (2006.01); B29C 71/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.