Cupertino, CA, United States of America

Evan R Boyle

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2015-2017

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Evan R Boyle

Introduction

Evan R Boyle is a prominent inventor based in Cupertino, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing memory package designs, which are crucial for the performance of electronic devices.

Latest Patents

One of Evan's latest patents is titled "Systems and methods for high-speed, low-profile memory packages and pinout designs." This innovation provides systems and methods for stacked semiconductor memory packages. Each package includes an integrated circuit (IC) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel is located on one side of the IC package substrate, allowing signals from each channel to be routed to the memory dies from their respective sides.

Career Highlights

Evan R Boyle has established himself as a key figure in the semiconductor industry. His work at Apple Inc. has positioned him at the forefront of technological advancements in memory packaging. His innovative designs have the potential to significantly improve the efficiency and performance of electronic devices.

Collaborations

Evan has collaborated with notable colleagues, including Anthony Fai and Zhiping Yang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Evan R Boyle's contributions to semiconductor technology and memory package design are noteworthy. His innovative patents and collaborations reflect his commitment to advancing the field. His work continues to influence the development of high-performance electronic devices.

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