The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Sep. 15, 2016
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Anthony Fai, Palo Alto, CA (US);
Evan R. Boyle, Cupertino, CA (US);
Zhiping Yang, Cupertino, CA (US);
Zhonghua Wu, Cupertino, CA (US);
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 24/06 (2013.01); H01L 25/065 (2013.01); H01L 2224/06151 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/1405 (2013.01); H01L 2224/1414 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06555 (2013.01);
Abstract
Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit ('IC') package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.