Apple Inc.

Evan R Boyle

Anthony Fai

Zhiping Yang

Zhonghua Wu

Avraham Poza Meir

Barak Rotbard

Christopher John Sarcone

Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit ('IC') package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Systems and methods for high-speed, low-profile memory packages and pinout designs

A storage device includes a non-volatile memory, a volatile memory and a controller. The volatile memory supports a normal mode and a self-refresh mode. The controller is configured to store data for a host in the non-volatile memory while using the volatile memory in the normal mode and, in response to receiving a power-down command from the host, to deactivate at least part of the storage device and to switch the volatile memory from the normal mode to the self-refresh mode.

Solid state drive with self-refresh power saving mode

Growing community of inventors

Cupertino, CA, United States of America

Evan R Boyle