Chestnut Ridge, NJ, United States of America

Evan G Colgan

This inventor holds 1 USPTO granted patent. Top assignee: Globalfoundries U.S. 2 LLC. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Evan G Colgan. Retrieved from https://idiyas.com/inventor/evan-g-colgan-ozjir

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Evan G. Colgan

Introduction

Evan G. Colgan is a notable inventor based in Chestnut Ridge, NJ (US). He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing the manufacturing processes of three-dimensional chip packages.

Latest Patents

Evan G. Colgan holds 1 patent for his invention titled "Alignment of Integrated Circuit Chip Stack." This patent describes methods and devices for manufacturing a three-dimensional chip package. The methods include forming a linear groove on an alignment rail, attaching an alignment rod to the groove, and aligning multiple integrated circuit chips by stacking them along the rail. Another method involves forming an alignment ridge on the rail and aligning the chips similarly.

Career Highlights

Evan is currently employed at GlobalFoundries U.S. 2 LLC, where he applies his expertise in integrated circuit technology. His innovative approaches have contributed to advancements in chip manufacturing processes.

Collaborations

Evan has collaborated with notable coworkers such as Steven Alan Cordes and Daniel C. Edelstein. Their combined efforts have furthered the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Evan G. Colgan's contributions to the field of integrated circuits exemplify the importance of innovation in technology. His patent and work at GlobalFoundries U.S. 2 LLC highlight his role in advancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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