The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jul. 22, 2013
International Business Machines Corporation, Armonk, NY (US);
Evan G. Colgan, Chestnut Ridge, NJ (US);
Steven A. Cordes, Yorktown Heights, NY (US);
Daniel C. Edelstein, White Plains, NY (US);
Vijayeshwar D. Khanna, Millwood, NY (US);
Kenneth Latzko, Carmel, NY (US);
Qinghuang Lin, Yorktown Heights, NY (US);
Peter J. Sorce, Poughkeepsie, NY (US);
Sri M. Sri-Jayantha, Ossining, NY (US);
Robert L. Wisnieff, Ridgefield, CT (US);
Roy R. Yu, Poughkeepsie, NY (US);
GLOBALFOUNDRIES U.S. 2 LLC, Hopewell Junction, NY (US);
Abstract
The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.