Eunkyul Oh

Title: Eunkyul Oh: A Pioneer in Semiconductor Innovation

Introduction

Eunkyul Oh is a notable inventor based in Gwacheon-si, South Korea. With a portfolio of five patents, he has made significant contributions to the field of semiconductor technology. His innovative approaches have enhanced the reliability and efficiency of semiconductor packages, making him a key player in the industry.

Latest Patents

Eunkyul Oh's most recent patent focuses on a semiconductor package and the method of fabricating it. The disclosed technology involves a novel stacking technique for semiconductor chips using a thermo-compression bonding (TCB) method. This method minimizes defects, thereby improving overall reliability. The semiconductor package features an interface chip with a first test pad, a bump pad integrated within the first test pad, and a first through silicon via (TSV) connecting the two. Additionally, the package includes at least one memory chip that is stacked on the interface chip. This memory chip comprises a second test pad, a dummy pad within the second test pad, and a second TSV linking them. Notably, the design includes an adhesive layer between the interface chip and the memory chip, eliminating bumps on both the first and second test pads.

Career Highlights

Eunkyul Oh is currently employed at Samsung Electronics Co., Ltd., where he has been able to develop and patent cutting-edge technologies. His dedication to improving semiconductor packaging has earned him recognition within the industry and placed him at the forefront of innovation in this intricate field.

Collaborations

Eunkyul has collaborated with talented coworkers, including Yunrae Cho and Taeheon Kim. This teamwork fosters an environment of shared ideas and innovative approaches, enhancing the overall impact of their projects in semiconductor development.

Conclusion

Eunkyul Oh’s expertise in semiconductor technology and his commitment to innovation continue to drive advancements in the industry. His work at Samsung Electronics Co., Ltd., coupled with his recent patents, positions him as a pivotal figure in the evolution of semiconductor packaging methodologies. As technology progresses, Eunkyul's contributions are sure to play a critical role in shaping the future of the field.