Eun Yeong Son

Title: Eun Yeong Son: Innovator in Semiconductor Packaging

Introduction

Eun Yeong Son is a notable inventor based in Eumseong, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods.

Latest Patents

Eun Yeong Son holds a patent for a semiconductor package that includes a redistribution structure. This structure features at least one redistribution insulating layer and at least one redistribution pattern. The semiconductor package also contains at least one semiconductor chip located on the redistribution structure, along with a molding layer that covers the semiconductor chip. The redistribution pattern is designed with a redistribution via that passes through the insulating layer and extends in a first direction perpendicular to the top surface of the redistribution structure. Additionally, a redistribution line extends in a second direction parallel to the top surface. The design includes specific inclinations for the inner side walls of the redistribution via, and the thickness difference between the central portion and the edge of the redistribution line ranges from 1% to 10% of the central thickness.

Career Highlights

Eun Yeong Son is associated with Nepes Co., Ltd., a company known for its advancements in semiconductor technology. His work has contributed to the development of efficient and innovative semiconductor packaging solutions.

Collaborations

Eun Yeong Son has collaborated with talented coworkers, including Yong Tae Kwon and Hyo Young Kim, who have also contributed to the field of semiconductor technology.

Conclusion

Eun Yeong Son's innovative work in semiconductor packaging highlights his role as a key inventor in the industry. His contributions continue to influence advancements in technology and manufacturing processes.