Eun Jin Jeong

Title: Eun Jin Jeong: Innovator in Semiconductor Technology

Introduction

Eun Jin Jeong is a notable inventor based in Chungbuk, South Korea. She has made significant contributions to the field of semiconductor technology, particularly through her innovative patent.

Latest Patents

Eun Jin Jeong holds a patent for a semiconductor device and method of forming a duplex plated bump-on-lead pad over a substrate for finer pitch between adjacent traces. This invention involves a substrate with a conductive layer formed over it. A duplex plated bump on lead pad is created over the substrate, and an insulating layer is applied over both the conductive layer and the substrate. A portion of the insulating layer over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer serves as a lamination layer, and the duplex plated bump on lead pad features a wide bump on lead pad. A semiconductor die is then mounted over the substrate, which includes a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between them. Additionally, a duplex plated contact pad is formed on the surface of the substrate opposite the duplex plated bump-on-lead pad. Eun Jin Jeong has 1 patent to her name.

Career Highlights

Eun Jin Jeong is currently employed at Stats Chippac Pte. Ltd., where she continues to advance her research and development in semiconductor technologies. Her work has been instrumental in enhancing the efficiency and performance of semiconductor devices.

Collaborations

Eun Jin Jeong collaborates with talented colleagues, including Soo Won Lee and Kyu Won Lee, who contribute to her innovative projects and research endeavors.

Conclusion

Eun Jin Jeong is a pioneering inventor in the semiconductor industry, with a focus on developing advanced technologies that improve device performance. Her contributions are shaping the future of semiconductor applications.