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For the Inventor, By the Inventor

Richmond, TX, United States of America

Ernest J Russell

USPTO Granted Patents = 18

Average Co-Inventor Count = 1.4

ph-index = 12

Forward Citations = 324(Granted Patents)


Company Filing History:

goldMedal18 out of 29,256 
 
Texas Instruments Corporation
 patents

Years Active: 1990-2002

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18 patents (USPTO):Explore Patents
1. 6465278 - Method and apparatus for delivering electrical power to a semiconductor die (2002-10-15),
2. 6268643 - Lead frame device for delivering electrical power to a semiconductor die (2001-07-31),
3. 6040983 - Vertical passive components for surface mount assembly (2000-03-21),
4. 5671125 - Vertical package mounted on both sides of a printed circuit board (1997-09-23),
5. 5637828 - High density semiconductor package (1997-06-10),
6. 5600178 - Semiconductor package having interdigitated leads (1997-02-04),
7. 5589420 - Method for a hybrid leadframe-over-chip semiconductor package (1996-12-31),
8. 5545920 - Leadframe-over-chip having off-chip conducting leads for increased bond (1996-08-13),
9. 5534729 - Integrated circuit lead frame for coupling to non-neighboring bond pads (1996-07-09),
10. 5521426 - Reduced capacitance lead frame for lead on chip package (1996-05-28),
11. 5483024 - High density semiconductor package (1996-01-09),
12. 5432678 - High power dissipation vertical mounted package for surface mount (1995-07-11),
13. 5413970 - Process for manufacturing a semiconductor package having two rows of (1995-05-09),
14. 5396701 - Method for packaging an integrated circuit (1995-03-14),
15. 5275975 - Method of making a relatively flat semiconductor package having a (1994-01-04),

Title: The Innovations of Ernest J. Russell

Introduction: Ernest J. Russell is a notable inventor based in Richmond, TX, known for his significant contributions to the field of electrical engineering. With a remarkable portfolio of 18 patents, Russell has made substantial advancements, particularly in the technology surrounding semiconductor devices.

Latest Patents: Among his latest inventions is a method and apparatus for delivering electrical power to a semiconductor die. This innovation encompasses a metal frame applied to the surface of a semiconductor die, featuring two voltage leads positioned adjacent to series of bond pads. The design includes longitudinal portions adjacent to the center bond pads and corner or arm portions next to bond pads in the die's quadrants, ensuring efficient power delivery. Another noteworthy patent by Russell elaborates on the same concept, further refining the apparatus for enhanced performance in semiconductor applications.

Career Highlights: Throughout his career, Russell has been associated with Texas Instruments Corporation, a leading technology company renowned for its innovations in semiconductor technology. His work has played a crucial role in advancing the capabilities of electrical power delivery in various applications.

Collaborations: Russell has collaborated with esteemed colleagues such as Daniel A. Baudouin and James S. Wallace. Together, they have contributed to the progression of technology and the creation of new solutions that benefit the semiconductor industry.

Conclusion: Ernest J. Russell's commitment to innovation in the field of electrical engineering has resulted in a remarkable array of patents that continue to influence technology today. His work not only exemplifies the spirit of invention but also illustrates the critical importance of collaboration among inventors in driving advancements that shape our technological landscape.

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