The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2001
Filed:
Dec. 04, 1998
Applicant:
Inventor:
Ernest J. Russell, Richmond, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A method and apparatus for delivering electrical power to a semiconductor die is provided in which a metal frame (,) is applied to the top surface of a semiconductor die. The metal frame include two voltages leads (,), each adjacent to each series of bond pads (,) formed on the top surface of the semiconductor die. Each voltage lead includes a longitudinal portion (,) adjacent bond pads (,) in the center of the semiconductor die and corner portions (,) or arm portions (,) adjacent bond pads (,) located in the quadrants (,) of the semiconductor die.