The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 1997
Filed:
Jun. 07, 1995
Applicant:
Inventors:
Ernest J Russell, Richmond, TX (US);
Daniel A Baudouin, Missouri City, TX (US);
Duy-Loan T Le, Missouri City, TX (US);
James Wallace, Sugar Land, TX (US);
Assignee:
Texas Instruments Inc., Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
174 522 ; 257787 ; 257723 ;
Abstract
The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.
Russell, Ernest. (1997). High density semiconductor package (U.S. Patent No. 5637828). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5637828
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile