This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Google Inc.. Active years: 2018-2019.
Company Filing History:
Years Active: 2018-2019
Title: The Innovations of Erick Tuttle
Introduction
Erick Tuttle is an accomplished inventor based in Morgan Hill, CA (US). He has made significant contributions to the field of electronic packaging, holding 2 patents that showcase his innovative spirit and technical expertise.
Latest Patents
One of Erick Tuttle's latest patents is a package stiffener designed for protecting semiconductor die. This invention relates to electronic packages and involves a lidless electronic package that includes a substrate with a surface and a die positioned on that surface. The die features an outside perimeter, a bottom surface adjacent to the substrate, and a top surface. The electronic package incorporates a stiffener on the substrate's surface, which has a first surface at a greater distance from the substrate than the top surface of the die. This design ensures enhanced protection for the semiconductor die.
Career Highlights
Erick Tuttle is currently employed at Google Inc., where he continues to push the boundaries of innovation in technology. His work focuses on improving electronic packaging solutions, which are crucial for the advancement of semiconductor technology.
Collaborations
Throughout his career, Erick has collaborated with notable colleagues, including Madhusudan K Iyengar and Teckgyu Kang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Erick Tuttle's contributions to the field of electronic packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and a desire to improve the functionality and reliability of electronic devices.