The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Feb. 01, 2018
Google Llc, Mountain View, CA (US);
William Edwards, Mountain View, CA (US);
Erick Tuttle, Morgan Hill, CA (US);
Madhusudan Krishnan Iyengar, Foster City, CA (US);
Yuan Li, Sunnyvale, CA (US);
Jorge Padilla, Union City, CA (US);
Woon Seong Kwon, Santa Clara, CA (US);
TeckGyu Kang, Saratoga, CA (US);
Google LLC, Mountain View, CA (US);
Abstract
The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.