Google Inc.

Erick Tuttle

Madhusudan K Iyengar

Yuan Hang Li

Teckgyu Kang

Jorge Padilla

William F Edwards

Woon-Seong Kwon

Woon Seong Kwon

Yuan Li

Madhusudan Krishnan Iyengar

The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

Package stiffener for protecting semiconductor die

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Morgan Hill, CA, United States of America

Erick Tuttle