Erich Preiner

Title: The Innovative Journey of Erich Preiner

Introduction

Erich Preiner, an accomplished inventor based in St. Michael, Austria, has made significant contributions to the field of component carrier technology. With a remarkable portfolio of four patents, his work emphasizes innovation in manufacturing processes and materials.

Latest Patents

Among Erich Preiner's latest patents is a cutting-edge component carrier that features a photoimageable dielectric layer combined with a structured conductive layer. This innovative design functions as a mask for selectively exposing the dielectric layer to electromagnetic radiation. The disclosed method involves creating a layer stack with component carrier materials, forming a photoimageable dielectric layer structure, and applying a spatial pattern of electrically conductive layers. This process allows for selective exposure and material removal based on predefined spatial patterns.

Another notable patent highlights a component carrier embedded with a component that is covered by a functional film with an inhomogeneous thickness distribution. This design includes a stack of electrically conductive and insulating layers that not only encase the component but also enhance its functionality through the carefully engineered film thickness.

Career Highlights

Erich Preiner is affiliated with AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading provider in the field of high-tech printed circuit boards and electronic systems. His role at AT&S has enabled him to develop and patent innovative manufacturing methods that are pivotal for modern electronic applications.

Collaborations

Throughout his career, Erich has collaborated with notable colleagues, including Wolfgang Schrittwieser and Mike Morianz. These partnerships have fostered a dynamic environment for brainstorming and developing complex technological advancements, further enhancing the quality and scope of their work.

Conclusion

Erich Preiner's innovative spirit and dedication to advancing component carrier technologies serve as an inspiration in the field of electronics. With an impressive array of patents and collaborative efforts, he continues to contribute to the evolution of manufacturing processes, ensuring that his work remains at the forefront of industry developments.