The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Jun. 23, 2014
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Wolfgang Schrittwieser, Kapfenberg, AT;

Mike Morianz, Graz, AT;

Alexander Kasper, Graz, AT;

Erich Preiner, St. Michael, AT;

Thomas Krivec, Zeltweg, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 3/02 (2006.01); H01L 21/56 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/185 (2013.01); H05K 3/4697 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/92144 (2013.01); H05K 3/0026 (2013.01); H05K 3/02 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0574 (2013.01); H05K 2203/1469 (2013.01);
Abstract

A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.


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