Eric M Lee

Title: Innovations of Eric M Lee

Introduction

Eric M Lee is a prominent inventor based in Fort Collins, Colorado. He has made significant contributions to the field of technology, particularly in the area of high-speed interconnects. With a total of five patents to his name, Lee's work has had a substantial impact on the industry.

Latest Patents

One of Eric M Lee's latest patents is titled "Bimodal PHY for low latency in high speed interconnects." This invention includes systems, methods, and apparatuses that feature a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks contains a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface is designed with a low pin count PIPE interface, which comprises a small set of wires connecting the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over this low pin count PIPE interface to access the PHY PIPE registers, while the PHY block is similarly configured to access the MAC PIPE registers. Additionally, the PHY block can be selectively configured to implement a PIPE architecture for PIPE mode operation and a serialization and deserialization (SERDES) architecture for SERDES mode operation.

Career Highlights

Eric M Lee is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies. His work at Intel has positioned him as a key player in the advancement of high-speed interconnect solutions.

Collaborations

Throughout his career, Lee has collaborated with notable colleagues, including Venkatraman Iyer and Rahul R Shah. These collaborations have further enhanced his contributions to the field.

Conclusion

Eric M Lee's innovative work and patents in high-speed interconnect technology demonstrate his significant role in the advancement of the industry. His contributions continue to influence the development of efficient communication systems.