Eric Condo

Title: Innovations of Eric Condo in Vapor Deposition Technology

Introduction

Eric Condo is a notable inventor based in Shelton, CT (US), recognized for his contributions to the field of vapor deposition technology. With a total of three patents to his name, Condo has made significant advancements in the development of etch-resistant films used in various manufacturing processes.

Latest Patents

One of Eric Condo's latest patents involves a plasma enhanced atomic layer deposition (PEALD) process for depositing etch-resistant SiOCN films. This innovative process provides improved growth rates, enhanced step coverage, and excellent etch resistance to wet etchants and post-deposition plasma treatments containing O and NH co-reactants. The PEALD process relies on one or more precursors reacting in tandem with plasma exposure to deposit these etch-resistant thin films of SiOCN. The films exhibit remarkable resistance to wet etching with dilute aqueous HF solutions, both after deposition and following post-deposition plasma treatments. Consequently, these films are expected to demonstrate excellent stability during post-deposition fabrication steps utilized in device manufacturing.

Career Highlights

Eric Condo has built a successful career at Entegris, Inc., where he has been instrumental in advancing vapor deposition technologies. His work has contributed to the development of innovative solutions that enhance the performance and reliability of semiconductor devices.

Collaborations

Throughout his career, Condo has collaborated with notable colleagues, including Bryan Clark Hendrix and Thomas H Baum. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Eric Condo's contributions to vapor deposition technology have significantly impacted the manufacturing processes of semiconductor devices. His innovative patents and collaborative efforts continue to drive advancements in the field.