This inventor holds 1 USPTO granted patent. Top assignee: Teradyne, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Eric Boiselle in Circuit Board Technology
Introduction
Eric Boiselle is an accomplished inventor based in Lynnfield, MA (US). He has made significant contributions to the field of circuit board technology. His innovative approach has led to the development of a unique patent that addresses common challenges in circuit board assembly.
Latest Patents
Eric Boiselle holds a patent for a method titled "Flattening a circuit board assembly using vacuum pressure." This patent describes a process that involves attaching a circuit board assembly to a structure that partly encloses a space, creating an air-tight seal. The method includes applying vacuum pressure to the space, which forces part of the circuit board assembly toward the space. Additionally, it allows for the selective dispensing of thermal interface material onto parts of the circuit board assembly while the vacuum pressure is applied. This innovation enhances the efficiency and effectiveness of circuit board assembly.
Career Highlights
Eric Boiselle is currently employed at Teradyne, Inc., a leading company in the field of automated test equipment. His work at Teradyne has allowed him to apply his inventive skills to real-world applications, contributing to advancements in technology and product development.
Conclusion
Eric Boiselle's contributions to circuit board technology through his innovative patent demonstrate his expertise and commitment to improving electronic assembly processes. His work continues to influence the industry positively.