The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
May. 18, 2022
Teradyne, Inc., North Reading, MA (US);
Eric Boiselle, Lynnfield, MA (US);
Teradyne, Inc., North Reading, MA (US);
Abstract
An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates an air-tight seal over the space, and where the structure has at least one port in fluid communication with the space. The method also includes applying vacuum pressure to the space via the at least one port, where the vacuum pressure forces at least part of the circuit board assembly toward the space, and dispensing thermal interface material selectively onto parts of the circuit board assembly while the vacuum pressure is applied.