Company Filing History:
2 out of 21 
2 out of 12 Years Active: 2015-2017
Title: Enyong Tai: Innovator in Semiconductor Technology
Introduction
Enyong Tai is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing semiconductor devices and packaging methods.
Latest Patents
Enyong Tai's latest patents include innovative designs that improve semiconductor packaging. One of his patents describes a semiconductor device that features an independent film layer for embedding and spacing semiconductor die. This design allows for a more efficient arrangement of stacked semiconductor die, facilitating a flip chip arrangement that eliminates the need for wire bonds. Additionally, he has developed a non-uniform vacuum profile die attach tool, which aids in the separation of semiconductor die from tape during the wafer dicing process. This tool utilizes a vacuum tip with a unique array of holes to grip the semiconductor wafer effectively.
Career Highlights
Throughout his career, Enyong Tai has worked with notable companies in the semiconductor industry. He has been associated with SanDisk Information Technology (Shanghai) Co., Ltd. and SanDisk Semiconductor (Shanghai) Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor innovations.
Collaborations
Enyong Tai has collaborated with several professionals in his field, including Li Ping Wang and King Hoo Ong. These collaborations have likely enriched his work and led to further advancements in semiconductor technology.
Conclusion
Enyong Tai is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the industry. His innovative patents and career achievements reflect his dedication to improving semiconductor devices and packaging methods.