The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Feb. 28, 2011
Pradeep Kumar Rai, Jangipur, IN;
Kim Lee Bock, Shanghai, CN;
LI Wang, Shanghai, CN;
Jinxiang Huang, Shanghai, CN;
Enyong Tai, Shanghai, CN;
Jianhua Wang, Shanghai, CN;
King Hoo Ong, Shanghai, CN;
Pradeep Kumar Rai, Jangipur, IN;
Kim Lee Bock, Shanghai, CN;
Li Wang, Shanghai, CN;
JinXiang Huang, Shanghai, CN;
EnYong Tai, Shanghai, CN;
JianHua Wang, Shanghai, CN;
King Hoo Ong, Shanghai, CN;
SanDisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Abstract
A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.