Shanghai, China

En-Yong Tai

This inventor holds 1 USPTO granted patent. Top assignees: Sandisk Information Technology (Shanghai) Co., Ltd., Sandisk Semiconductor (Shanghai) Co. Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: En-Yong Tai. Retrieved from https://idiyas.com/inventor/en-yong-tai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016

Loading Chart...
1 patent (USPTO):Explore Patents

Title: En-Yong Tai: Innovator in Semiconductor Technology

Introduction

En-Yong Tai is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of semiconductor die lamination.

Latest Patents

En-Yong Tai holds a patent for a semiconductor die laminating device with independent drives. This device allows for the lamination of semiconductor die onto substrates on a panel of substrates. The key feature of this invention is that the lamination units operate independently, enabling a row or column of semiconductor die to be laminated onto a row or column of substrates simultaneously.

Career Highlights

Throughout his career, En-Yong Tai has worked with prominent companies in the semiconductor industry. He has been associated with SanDisk Information Technology (Shanghai) Co., Ltd. and SanDisk Semiconductor (Shanghai) Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies.

Collaborations

En-Yong Tai has collaborated with several professionals in his field, including Wei Gu and Zhong Lu. These collaborations have likely enriched his work and contributed to the advancements in semiconductor technology.

Conclusion

En-Yong Tai is a distinguished inventor whose work in semiconductor die lamination has made a significant impact in the industry. His innovative patent showcases his commitment to advancing technology in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…