The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
May. 07, 2012
Wei Gu, Shanghai, CN;
Zhong LU, Shanghai, CN;
Cheeman Yu, Fremont, CA (US);
Chin-tien Chiu, Taichung, TW;
En-yong Tai, Shanghai, CN;
Min NI, Shanghai, CN;
Wei Gu, Shanghai, CN;
Zhong Lu, Shanghai, CN;
Cheeman Yu, Fremont, CA (US);
Chin-Tien Chiu, Taichung, TW;
En-Yong Tai, Shanghai, CN;
Min Ni, Shanghai, CN;
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
SanDisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
Abstract
A laminating device () and method are disclosed for laminating semiconductor die () on substrates on a panel () of substrates. The laminating device () includes lamination units () that operate independently of each other so that a row or column of semiconductor die () may be independently laminated onto a row or column of substrates simultaneously.