Emiko Higashinakagawa

This inventor holds 10 USPTO granted patents. Top assignees: Kabushiki Kaisha Toshiba, Tokyo Shibaura Denki Kabushiki Kaisha. Active years: 1985-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Emiko Higashinakagawa. Retrieved from https://idiyas.com/inventor/emiko-higashinakagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 68(Granted Patents)

Location History:

Kawasaki, JP (1985 - 1996)
Tokyo, JP (2002 - 2003)

Company Filing History:

8 out of 53,286

Kabushiki Kaisha Toshiba

patents

2 out of 2,916

Tokyo Shibaura Denki Kabushiki Kaisha

patents

Years Active: 1985-2003

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6651870 - Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate (2003-11-25),

2. 6457632 - Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy (2002-10-01),

3. 5578898 - Shadow mask and cathode ray tube (1996-11-26),

4. 5532088 - Shadow mask plate material and shadow mask (1996-07-02),

5. 5030414 - Nuclear fuel rod (1991-07-09),

6. 4846747 - Shadow mask, and method of manufacturing the same (1989-07-11),

7. 4827178 - Image display tube (1989-05-02),

8. 4771213 - Shadow mask (1988-09-13),

9. 4528246 - Shadow mask (1985-07-09),

10. 4504327 - Corrosion-resistant and wear-resistant magnetic amorphous alloy and a (1985-03-12),

Title: Emiko Higashinakagawa: Innovator in Solder Alloy Technology

Introduction

Emiko Higashinakagawa is a prominent inventor based in Kawasaki, Japan. She has made significant contributions to the field of electronic components through her innovative work in solder alloys. With a total of 10 patents to her name, her inventions have advanced the technology used in bonding electronic parts.

Latest Patents

Higashinakagawa's latest patents include a solder alloy designed for bonding electric or electronic parts. This solder alloy contains 3 to 12% by weight of a zinc component and a tin component. Notably, the oxygen content of the solder alloy is reduced to 100 ppm or less. This innovation allows for the formation of a bonding portion on the substrate, enabling the mounting of electronic parts. The bonding portion made from this solder alloy effectively prevents migration, enhancing the reliability of electronic assemblies.

Career Highlights

Throughout her career, Emiko has worked with notable companies such as Toshiba Corporation and Tokyo Shibaura Electric Co., Ltd. Her experience in these organizations has allowed her to refine her expertise in electronic component technology and solder materials.

Collaborations

Higashinakagawa has collaborated with esteemed colleagues, including Yasuhisa Ohtake and Michihiko Inaba. These partnerships have contributed to her innovative projects and the development of her patented technologies.

Conclusion

Emiko Higashinakagawa's work in solder alloy technology has made a significant impact on the electronics industry. Her patents reflect her dedication to improving the reliability and efficiency of electronic components. Through her innovations, she continues to pave the way for advancements in electronic manufacturing.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]