The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Aug. 08, 2002
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/514 ;
U.S. Cl.
CPC ...
B23K 3/514 ;
Abstract
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
Teshima, Kouichi. (2003). Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate (U.S. Patent No. 6651870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6651870
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile