Company Filing History:
9 out of 52,766 
1 out of 1 
1 out of 832,912 Years Active: 2000-2004
Title: Kouichi Teshima: Innovator in Solder Materials
Introduction
Kouichi Teshima is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder materials, holding a total of 10 patents. His work focuses on developing high-performance solder materials for electronic devices, which are crucial for modern technology.
Latest Patents
Teshima's latest patents include innovative solder materials and manufacturing processes. One notable patent describes a high-temperature solder material composed of tin, zinc, and silver, or a combination of germanium or aluminum with tin. This solder material is designed for producing electric and electronic devices, ensuring reliability and performance. Another patent details a solder alloy used for bonding electronic parts, which contains a specific percentage of zinc and tin components. This solder alloy is engineered to reduce oxygen content, enhancing the quality of the bonding portion and preventing migration.
Career Highlights
Throughout his career, Kouichi Teshima has worked with notable companies, including Kabushiki Kaisha Toshiba. His expertise in solder materials has positioned him as a key figure in the development of advanced electronic components.
Collaborations
Teshima has collaborated with several professionals in his field, including Masahiro Tadauchi and Izuru Komatsu. These collaborations have contributed to the advancement of solder technology and its applications in electronics.
Conclusion
Kouichi Teshima's innovative work in solder materials has significantly impacted the electronics industry. His patents reflect a commitment to enhancing the performance and reliability of electronic devices.