Kabushiki Kaisha Toshiba

Other

Kuroda Denki Kabushiki Kaisha

Kouichi Teshima

Izuru Komatsu

Masahiro Tadauchi

Tomiaki Furuya

Takeshi Gotanda

Mitsuhiro Tomita

Shinji Arai

Emiko Higashinakagawa

Yoshiyuki Goto

Makoto Gonda

Takayuki Suzuki

Masao Koyama

Naohiko Oyasato

Kazutaka Matsumoto

Tetsuji Hori

Hiroshi Tateishi

Terunobu Hayata

Fuminobu Tezuka

Tomohiro Todoroki

Teruhisa Ogihara

Yoshiaki Yokoyama

Kaichiro Ogihara

Jun Sugimoto

Mitsuyoshi Hirayama

Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.

Solder material, device using the same and manufacturing process thereof

Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.

Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate

Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

Soldering method and soldering apparatus

Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy

Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.

Solder material and method of manufacturing solder material

A processing apparatus capable of separating and recovering resins and metals, respectively, from an object being processed, which has resins and metals as its constituent, comprises a first gastight area (,), in which temperature and pressure are regulated so as to permit selective thermal decomposition of resins from the object (,) being processed, a second gastight area (,), which is partitioned from the first gastight area by an openable and closeable partition (,C) and in which temperature and pressure are regulated so as to permit selective vaporization of metals from the object, first recovering chamber (,) connected to the first gastight area for recovering gases produced by thermal decomposition of resins, and second recovering chamber (,) connected to the second gastight area for recovering vaporized metals.

Processing apparatus, processing system and processing method

Substrate with solder alloy for mounting electronic parts

Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG.,which satisfies the formulas: 1&lE;x&lE;20, 3&lE;y&lE;13 and 3&lE;(x&plus;y)/2&lE;13, or formulas: 0.1&lE;x&lE;25, 2&lE;y&lE;15 and 2&lE;(x&plus;y)/2&lE;15.

Method of joining metallic members, and joined metallic members

Growing community of inventors

Tokyo, Japan

Kouichi Teshima